The EEMI450 project is funded by the ENIAC Joint Undertaking and by the Public Autothority of the countries involved.
ENIAC_project_profile - EEMI450
Project Targets:
The project addresses the complete spectrum of E&M 450mm development
- Wafer manufacturing and characterisation
- Metrology
- Waferhandling and automation
- Development of process modules, both batch and single wafer, including the supply chain.
- Lithography
- This project is the first occasion that a large number of EU E&M companies decide to cooperate to achieve benefits for all and reduce development time
- Is meant to put 450mm on the European radar screen
- The consortium has therefore opted for rather short project duration to lay the basics of further developments as a broad European effort in this new arena
- Basic concepts and standards will be discussed
- First 450mm wafers will be produced
- First proof-of concepts and in some cases prototypes will be developed
- Based upon these initial learning further efforts will be (and already are) initiated to come to production worthy solutions
- Intel as a consortium member is an important driver of the global 450mm activities and will provide guidance to the project in view of specifications, standards and concepts.
- Define a common European "open" platform for 450mm, using already available standards, if needed defining new ones
- Develop modules/metrology components complying to these definitions (mechanical / electrical)
- Manufacture of 450mm wafers, first in handling quality, goal to achieve testwafer quality.
- Possible common software developments
- Emphasis on green solutions:
- Reduced energy consumption per processed die
- Reduced usage of resources
- Less waste
- Emphasis on APC/virtual metrology to reduce downtime and make process outcome more predictable
- Follow ITRS roadmap for 22nm node and beyond
- Current expectation of the interception node with 450mm is 22nm, but depending on the execution of the two roadmaps.